Manufacturer:
Harimatec Inc.
Description:
HMP 366 3% .022DIA. 23AWG
Detailed Description:
Leaded Rosin Activated (RA) Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 23 AWG, 24 SWG Spool, 8.8 oz (250g)
Product Status::
19788 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Pb93.5Sn5Ag1.5 (93.5/5/1.5) |
Diameter | 0.022" (0.56mm) |
Digi-Key Storage | - |
Flux Type | Rosin Activated (RA) |
Form | Spool, 8.8 oz (250g) |
Melting Point | 565 ~ 574°F (296 ~ 301°C) |
Mfr | Harimatec Inc. |
Package | Bulk |
Process | Leaded |
Product Status | Active |
Series | 366 |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Weight | 0.551 lb (249.93 g) |
Wire Gauge | 23 AWG, 24 SWG |