Manufacturer:
Harimatec Inc.
Description:
97SC 400 2% .022DIA 23AWG
Detailed Description:
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 23 AWG, 24 SWG Spool, 8.8 oz (250g)
Product Status::
19785 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.022" (0.56mm) |
Flux Type | No-Clean |
Form | Spool, 8.8 oz (250g) |
Melting Point | 423°F (217°C) |
Mfr | Harimatec Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | C400 |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | 59°F ~ 86°F (15°C ~ 30°C) |
Type | Wire Solder |
Weight | 0.55 lb (249.48 g) |
Wire Gauge | 23 AWG, 24 SWG |
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