Manufacturer:
Chip Quik Inc.
Description:
SOLDER SPHERES SN96.5/AG3.0/CU0.
Detailed Description:
Lead Free Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar
Product Status::
52362 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.010" (0.25mm) |
Flux Type | - |
Form | Jar |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | SMD2 |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Solder Sphere |
Weight | - |
Wire Gauge | - |
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