Manufacturer:
Chip Quik Inc.
Description:
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Detailed Description:
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 oz (28.35g)
Product Status::
52338 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMDSW |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.015" (0.38mm) |
Flux Type | No-Clean, Water Soluble |
Form | Spool, 1 oz (28.35g) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | SMD |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Weight | - |
Wire Gauge | - |