Manufacturer:
Kester Solder
Description:
NP560 SN96.5AG3.0CU0.5 T4 100 GM
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 3.53 oz (100g)
Product Status::
57806 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 70-4825 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Digi-Key Storage | Refrigerated |
Flux Type | No-Clean |
Form | Syringe, 3.53 oz (100g) |
Melting Point | 423 ~ 424°F (217 ~ 218°C) |
Mesh Type | 4 |
Mfr | Kester Solder |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | NP560 |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
Type | Solder Paste |
Weight | - |
Wire Gauge | - |
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