Manufacturer:
Chip Quik Inc.
Description:
LF SOLDER WIRE 99.3/0.7 TIN/COPP
Detailed Description:
Lead Free No-Clean, Water Soluble Wire Solder Sn99.3Cu0.7 (99.3/0.7) 24 AWG, 25 SWG Spool, 8 oz (227g), 1/2 lb
Product Status::
1568 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | SMD2 |
Package | Bulk |
Product Status | Active |
Type | Wire Solder |
Composition | Sn99.3Cu0.7 (99.3/0.7) |
Diameter | 0.020" (0.51mm) |
Melting Point | 441°F (227°C) |
Flux Type | No-Clean, Water Soluble |
Wire Gauge | 24 AWG, 25 SWG |
Process | Lead Free |
Form | Spool, 8 oz (227g), 1/2 lb |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
Shipping Info | - |
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