Manufacturer:
Chip Quik Inc.
Description:
THERMALLY STABLE SOLDER PASTE NO
Detailed Description:
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 8.8 oz (250g)
Product Status::
1559 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Sn63Pb37 (63/37) |
Diameter | - |
Melting Point | 361°F (183°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | Leaded |
Form | Jar, 8.8 oz (250g) |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
Shipping Info | - |
Base Product Number | TS391A |
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