Manufacturer:
Chip Quik Inc.
Description:
THERMALLY STABLE SOLDER PASTE NO
Detailed Description:
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Product Status::
1555 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Melting Point | 281°F (138°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | Lead Free |
Form | Jar, 8.8 oz (250g) |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
Shipping Info | - |
Base Product Number | TS391L |