Manufacturer:
Chip Quik Inc.
Description:
THERMALLY STABLE SOLDER PASTE NO
Detailed Description:
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 0.53 oz (15g), 5cc
Product Status::
1554 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Melting Point | 281°F (138°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | Lead Free |
Form | Syringe, 0.53 oz (15g), 5cc |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
Shipping Info | - |
Base Product Number | TS391L |
CWSN60 NCCW2.2 .015
SN60PB40 NCCW2.2% .015 !# SPL
$56.15 VIEW MORE
CWSN63 NCCW2.2 .015
SN63PB37 NCCW2.2% .015 1# SPL
$56.15 VIEW MORE
CWSN99.3 NCCW2.2 .032
SN99.3CU.7 NCCW2.2% .032 1# SPL
$72.18 VIEW MORE
CWSN60NCCW2 .032 1#
SN60PB40 NCCW2% .032 1# SPL
$47.21 VIEW MORE
EB SN63PB37 1#QA
ELECTTROLYTIC GRADE AAAA
$67.25 VIEW MORE