Manufacturer:
Chip Quik Inc.
Description:
THERMALLY STABLE SOLDER PASTE NO
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 0.53 oz (15g), 5cc
Product Status::
1551 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | Lead Free |
Form | Syringe, 0.53 oz (15g), 5cc |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
Shipping Info | - |
Base Product Number | TS391S |
CWSN60WRMAP3 .015
SN60PB40 WRMAP3 .015 DIA 1# SPL
$56.15 VIEW MORE
CWSN63WRAP3 .032
SN63PB37 WRAP3 .032 DIA 1# SPL
$47.21 VIEW MORE
CWSN60NCCW2 .062 1#
SN60PB40 NCCW2% .062 1# SPL
$43.41 VIEW MORE
CWSN60 NCCW2.2 .015
SN60PB40 NCCW2.2% .015 !# SPL
$56.15 VIEW MORE
CWSN63 NCCW2.2 .015
SN63PB37 NCCW2.2% .015 1# SPL
$56.15 VIEW MORE