Manufacturer:
LOCTITE
Description:
LOCTITE HF 212 90ISCDAP88.5 600G
Detailed Description:
Lead Free No-Clean Solder Paste SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Jar, 21.16 oz (600g)
Product Status::
35379 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | LOCTITE |
Series | HF212 |
Package | Bulk |
Product Status | Obsolete |
Type | Solder Paste |
Composition | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
Diameter | - |
Melting Point | 410 ~ 424°F (209 ~ 218°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Jar, 21.16 oz (600g) |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
Shipping Info | - |
CWSnCu0.7Ni NCCW2.2% .032 1#
CW SnCu0.7Ni NCCW 2.2% 0.032 1#
$91.3 VIEW MORE
CWSnCu0.7Ni RA3% .032 1#
CW SnCu0.7Ni WRAP 3% 0.032 1# SP
$91.3 VIEW MORE
CWSnCu0.7Ni RMA3% .032 1#
CW SnCu0.7Ni WRMAP 3% 0.032 1# S
$91.3 VIEW MORE
CWSnCu0.7Ni RMA3% .062 1#
CW SnCu0.7Ni WRMAP 3% 0.062 1# S
$89.99 VIEW MORE
CWSnCu0.7Ni NCCW2.2% .062 1#
CW SnCu0.7Ni NCCW 2.2% 0.062 1#
$89.99 VIEW MORE