Manufacturer:
Kester Solder
Description:
SOLDER PASTE NO CLEAN 500GM
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Product Status::
45741 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 70-4105 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 17.64 oz (500g) |
Melting Point | 423 ~ 424°F (217 ~ 218°C) |
Mesh Type | 3 |
Mfr | Kester Solder |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | NP545 |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
Type | Solder Paste |
Wire Gauge | - |