Manufacturer:
Kester Solder
Description:
SOLDER PASTE NXG1 NO CLEAN 500GM
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Product Status::
45732 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 70-3213 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 17.64 oz (500g) |
Melting Point | 423 ~ 424°F (217 ~ 218°C) |
Mesh Type | 3 |
Mfr | Kester Solder |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | NXG1 |
Shelf Life | 8 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
Type | Solder Paste |
Wire Gauge | - |
CWSN63WRAP3 .032
SN63PB37 WRAP3 .032 DIA 1# SPL
$47.21 VIEW MORE
CWSN60NCCW2 .062 1#
SN60PB40 NCCW2% .062 1# SPL
$43.41 VIEW MORE
CWSN60 NCCW2.2 .015
SN60PB40 NCCW2.2% .015 !# SPL
$56.15 VIEW MORE
CWSN63 NCCW2.2 .015
SN63PB37 NCCW2.2% .015 1# SPL
$56.15 VIEW MORE
CWSN99.3 NCCW2.2 .032
SN99.3CU.7 NCCW2.2% .032 1# SPL
$72.18 VIEW MORE