Manufacturer:
CUI Devices
Description:
HEAT SINK, EXTRUSION, TO-220, 50
Detailed Description:
Heat Sink TO-220 Aluminum Alloy 8.9W @ 75°C Board Level, Vertical
Product Status::
13921 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Bolt On and PC Pin |
Base Product Number | HSE-B20500 |
Diameter | - |
Fin Height | 0.492" (12.50mm) |
Length | 1.969" (50.00mm) |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Mfr | CUI Devices |
Package | Tray |
Package Cooled | TO-220 |
Power Dissipation @ Temperature Rise | 8.9W @ 75°C |
Product Status | Active |
Series | HSE |
Shape | Rectangular, Angled Fins |
Thermal Resistance @ Forced Air Flow | 4.85°C/W @ 200 LFM |
Thermal Resistance @ Natural | 8.43°C/W |
Type | Board Level, Vertical |
Width | 1.378" (35.00mm) |
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