Manufacturer:
CUI Devices
Description:
HEAT SINK, EXTRUSION, TO-218, 63
Detailed Description:
Heat Sink TO-218 Aluminum Alloy 13.7W @ 75°C Board Level, Vertical
Product Status::
13908 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSE |
Package | Box |
Product Status | Active |
Type | Board Level, Vertical |
Package Cooled | TO-218 |
Attachment Method | Bolt On and PC Pin |
Shape | Rectangular, Angled Fins |
Length | 2.500" (63.50mm) |
Width | 1.654" (42.00mm) |
Diameter | - |
Fin Height | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise | 13.7W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.78°C/W @ 200 LFM |
Thermal Resistance @ Natural | 5.47°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Base Product Number | HSE-B18635 |
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