Manufacturer:
CUI Devices
Description:
HEAT SINK, EXTRUSION, TO-218, 25
Detailed Description:
Heat Sink TO-218 Aluminum Alloy 8.1W @ 75°C Board Level, Vertical
Product Status::
13905 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSE |
Package | Box |
Product Status | Active |
Type | Board Level, Vertical |
Package Cooled | TO-218 |
Attachment Method | Bolt On and PC Pin |
Shape | Rectangular, Angled Fins |
Length | 1.000" (25.40mm) |
Width | 1.638" (41.60mm) |
Diameter | - |
Fin Height | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise | 8.1W @ 75°C |
Thermal Resistance @ Forced Air Flow | 3.09°C/W @ 200 LFM |
Thermal Resistance @ Natural | 9.26°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Base Product Number | HSE-B18254 |