Manufacturer:
CUI Devices
Description:
HEAT SINK, EXTRUSION, TO-220, 50
Detailed Description:
Heat Sink TO-220 Aluminum Alloy 12.2W @ 75°C Board Level, Vertical
Product Status::
13900 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSE |
Package | Box |
Product Status | Active |
Type | Board Level, Vertical |
Package Cooled | TO-220 |
Attachment Method | Bolt On and PC Pin |
Shape | Rectangular, Fins |
Length | 1.969" (50.00mm) |
Width | 1.378" (35.00mm) |
Diameter | - |
Fin Height | 1.000" (25.40mm) |
Power Dissipation @ Temperature Rise | 12.2W @ 75°C |
Thermal Resistance @ Forced Air Flow | 2.88°C/W @ 200 LFM |
Thermal Resistance @ Natural | 8.05°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Base Product Number | HSE-B500 |