Manufacturer:
CUI Devices
Description:
HEAT SINK, EXTRUSION, TO-220, 25
Detailed Description:
Heat Sink TO-220 Aluminum Alloy 3.1W @ 75°C Board Level
Product Status::
13896 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSE |
Package | Box |
Product Status | Active |
Type | Board Level |
Package Cooled | TO-220 |
Attachment Method | Bolt On |
Shape | Rectangular, Fins |
Length | 0.984" (25.00mm) |
Width | 0.625" (16.00mm) |
Diameter | - |
Fin Height | 0.354" (9.00mm) |
Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
Thermal Resistance @ Forced Air Flow | 7.07°C/W @ 200 LFM |
Thermal Resistance @ Natural | 24.19°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Base Product Number | HSE-B1711 |
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