Manufacturer:
CUI Devices
Description:
HEAT SINK TO-252 COPPER
Detailed Description:
Heat Sink TO-252 (DPak) Copper 2.1W @ 75°C Top Mount
Product Status::
39425 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | - |
Base Product Number | HSS-C52 |
Diameter | - |
Fin Height | 0.400" (10.16mm) |
Length | 0.315" (8.00mm) |
Material | Copper |
Material Finish | Tin |
Mfr | CUI Devices |
Package | Tape & Reel (TR) |
Package Cooled | TO-252 (DPak) |
Power Dissipation @ Temperature Rise | 2.1W @ 75°C |
Product Status | Active |
Series | HSS |
Shape | Rectangular, Fins |
Thermal Resistance @ Forced Air Flow | 10.05°C/W @ 200 LFM |
Thermal Resistance @ Natural | 35.71°C/W |
Type | Top Mount |
Width | 0.900" (22.86mm) |
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