Manufacturer:
CUI Devices
Description:
HEAT SINK TO-263 COPPER
Detailed Description:
Heat Sink TO-263 (D²Pak) Copper 3.8W @ 75°C Board Level
Product Status::
39390 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | - |
Base Product Number | HSS-C2540 |
Diameter | - |
Fin Height | 0.450" (11.43mm) |
Length | 0.763" (19.38mm) |
Material | Copper |
Material Finish | Tin |
Mfr | CUI Devices |
Package | Tape & Reel (TR), Cut Tape (CT), Digi-Reel® |
Package Cooled | TO-263 (D²Pak) |
Power Dissipation @ Temperature Rise | 3.8W @ 75°C |
Product Status | Active |
Series | HSS |
Shape | Rectangular, Fins |
Thermal Resistance @ Forced Air Flow | 5.50°C/W @ 200 LFM |
Thermal Resistance @ Natural | 21.90°C/W |
Type | Board Level |
Width | 1.000" (25.40mm) |