Manufacturer:
MG Chemicals
Description:
LEADED NO CLEAN SOLDER PASTE
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) Jar, 8.8 oz (250g)
Product Status::
21431 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 4900 |
Composition | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 8.8 oz (250g) |
Melting Point | 423 ~ 430°F (217 ~ 221°C) |
Mesh Type | - |
Mfr | MG Chemicals |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | 4900 |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 35°F ~ 50°F (2°C ~ 10°C) |
Type | Solder Paste |
Wire Gauge | - |
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