Manufacturer:
Chip Quik Inc.
Description:
SOLDER PASTE TWO PART MIX
Detailed Description:
Lead Free No-Clean Solder Paste, Two Part Mix Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 0.53 oz (15g)
Product Status::
24316 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMD291 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 0.53 oz (15g) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Jar |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
Type | Solder Paste, Two Part Mix |
Wire Gauge | - |