Manufacturer:
Chip Quik Inc.
Description:
SOLDER PASTE LOW TEMP T4 250G
Detailed Description:
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Product Status::
43719 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMDLTL |
Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter | - |
Digi-Key Storage | Refrigerated |
Flux Type | No-Clean |
Form | Jar, 8.8 oz (250g) |
Melting Point | 281°F (138°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Jar |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Type | Solder Paste |
Wire Gauge | - |
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