Manufacturer:
Harimatec Inc.
Description:
SOLDER PASTE HF 212 - 600GRAM JA
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 21.16 oz (600g)
Product Status::
1044 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Digi-Key Storage | - |
Flux Type | No-Clean |
Form | Jar, 21.16 oz (600g) |
Melting Point | 423°F (217°C) |
Mesh Type | - |
Mfr | Harimatec Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Obsolete |
Series | HF212 |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Solder Paste |
Wire Gauge | - |
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