Manufacturer:
Harimatec Inc.
Description:
HMP 366 3% .050DIA 16AWG
Detailed Description:
Leaded Rosin Activated (RA) Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 16 AWG, 18 SWG Spool, 17.64 oz (500g)
Product Status::
19788 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Pb93.5Sn5Ag1.5 (93.5/5/1.5) |
Diameter | 0.050" (1.27mm) |
Digi-Key Storage | - |
Flux Type | Rosin Activated (RA) |
Form | Spool, 17.64 oz (500g) |
Melting Point | 565 ~ 574°F (296 ~ 301°C) |
Mfr | Harimatec Inc. |
Package | Bulk |
Process | Leaded |
Product Status | Active |
Series | 366 |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Weight | 1.1 lbs (499 g) |
Wire Gauge | 16 AWG, 18 SWG |