Manufacturer:
Chip Quik Inc.
Description:
SLD WIRE NO-CLEAN 96.5/3/.5 1OZ.
Detailed Description:
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 oz (28.35g)
Product Status::
15411 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | SMDSW |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.020" (0.51mm) |
Digi-Key Storage | - |
Flux Type | No-Clean, Water Soluble |
Form | Spool, 1 oz (28.35g) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Mfr | Chip Quik Inc. |
Package | Spool |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Weight | 0.062 lb (28.12 g) |
Wire Gauge | 24 AWG, 25 SWG |
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