Manufacturer:
CUI Devices
Description:
HEAT SINK, STAMPING, TO-218/TO-2
Detailed Description:
Heat Sink TO-218, TO-220 Aluminum Alloy 4.5W @ 75°C Board Level, Vertical
Product Status::
6281 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSS |
Package | Bag |
Product Status | Active |
Type | Board Level, Vertical |
Package Cooled | TO-218, TO-220 |
Attachment Method | Bolt On and PC Pin |
Shape | Rectangular, Fins |
Length | 2.000" (50.80mm) |
Width | 1.378" (35.00mm) |
Diameter | - |
Fin Height | 0.335" (8.50mm) |
Power Dissipation @ Temperature Rise | 4.5W @ 75°C |
Thermal Resistance @ Forced Air Flow | 9.20°C/W @ 200 LFM |
Thermal Resistance @ Natural | 16.66°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
IW-HSKALU-CLASLR-CU03
ZU+ MPSOC SOM MODULE HEATSINK
$43.2 VIEW MORE
IW-HSKALU-CLASLR-SS01
I.MX 6DL/S SODIMM SOM HEATSINK
$20.6 VIEW MORE
IW-HSKALU-CLASLR-CU02
ARRIA10 SOC SOM HEATSINK
$43.2 VIEW MORE
IW-HSKALU-CLASLR-SS02
I.MX 6Q/D SODIMM SOM HEATSINK
$20.6 VIEW MORE
HS14
HEATSINK 8P TO-3 1.7C/W
$54.45 VIEW MORE