Manufacturer:
CUI Devices
Description:
HEAT SINK, EXTRUSION, TO-218/TO-
Detailed Description:
Heat Sink TO-218, TO-220 Aluminum Alloy 12.79W @ 75°C Board Level
Product Status::
6274 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Clip |
Diameter | - |
Fin Height | 1.772" (45.00mm) |
Length | 1.969" (50.00mm) |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Mfr | CUI Devices |
Package | Bag |
Package Cooled | TO-218, TO-220 |
Power Dissipation @ Temperature Rise | 12.79W @ 75°C |
Product Status | Active |
Series | HSE |
Shape | Rectangular, Fins |
Thermal Resistance @ Forced Air Flow | 2.10°C/W @ 200 LFM |
Thermal Resistance @ Natural | 5.86°C/W |
Type | Board Level |
Width | 1.181" (30.00mm) |
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