Manufacturer:
CUI Devices
Description:
HEAT SINK, BGA, 33.5 X 33.5 X 8
Detailed Description:
Heat Sink BGA Aluminum Alloy 4.94W @ 75°C Top Mount
Product Status::
6273 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSB |
Package | Box |
Product Status | Active |
Type | Top Mount |
Package Cooled | BGA |
Attachment Method | Adhesive |
Shape | Square, Pin Fins |
Length | 1.319" (33.50mm) |
Width | 1.319" (33.50mm) |
Diameter | - |
Fin Height | 0.315" (8.00mm) |
Power Dissipation @ Temperature Rise | 4.94W @ 75°C |
Thermal Resistance @ Forced Air Flow | 5.30°C/W @ 200 LFM |
Thermal Resistance @ Natural | 15.19°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
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