Manufacturer:
CUI Devices
Description:
HEAT SINK, EXTRUSION, 19 X 31.5
Detailed Description:
Heat Sink Aluminum Alloy 2.95W @ 75°C Top Mount
Product Status::
6270 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSE |
Package | Box |
Product Status | Active |
Type | Top Mount |
Package Cooled | - |
Attachment Method | Thermal Tape, Adhesive (Included) |
Shape | Square, Angled Fins |
Length | 0.748" (19.00mm) |
Width | 0.748" (19.00mm) |
Diameter | - |
Fin Height | 0.295" (7.50mm) |
Power Dissipation @ Temperature Rise | 2.95W @ 75°C |
Thermal Resistance @ Forced Air Flow | 9.20°C/W @ 200 LFM |
Thermal Resistance @ Natural | 25.44°C/W |
Material | Aluminum Alloy |
Material Finish | Blue Anodized |