Manufacturer:
CUI Devices
Description:
HEAT SINK, BGA, 23 X 23 X 25 MM
Detailed Description:
Heat Sink BGA Aluminum Alloy 6.13W @ 75°C Top Mount
Product Status::
6267 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Adhesive |
Diameter | - |
Fin Height | 0.984" (25.00mm) |
Length | 0.906" (23.00mm) |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Mfr | CUI Devices |
Package | Box |
Package Cooled | BGA |
Power Dissipation @ Temperature Rise | 6.13W @ 75°C |
Product Status | Active |
Series | HSB |
Shape | Square, Pin Fins |
Thermal Resistance @ Forced Air Flow | 3.80°C/W @ 200 LFM |
Thermal Resistance @ Natural | 12.23°C/W |
Type | Top Mount |
Width | 0.906" (23.00mm) |