Manufacturer:
Canfield Technologies
Description:
SAC 305 NO CLEAN FLUX 8 OZ .031
Detailed Description:
Lead Free Rosin Mildly Activated (RMA) Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Spool, 1 lb (454 g)
Product Status::
8413 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Canfield Technologies |
Series | - |
Package | Spool |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423 ~ 424°F (217 ~ 218°C) |
Flux Type | Rosin Mildly Activated (RMA) |
Wire Gauge | - |
Process | Lead Free |
Form | Spool, 1 lb (454 g) |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Shipping Info | - |
Weight | - |
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