Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
BGA HEAT SINK
Detailed Description:
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Product Status::
2493 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Solder Anchor |
Base Product Number | 374324 |
Diameter | - |
Fin Height | 0.394" (10.00mm) |
Length | 1.063" (27.00mm) |
Material | Aluminum |
Material Finish | Black Anodized |
Mfr | Aavid, Thermal Division of Boyd Corporation |
Package | Bulk |
Package Cooled | BGA, FPGA |
Power Dissipation @ Temperature Rise | 1.5W @ 50°C |
Product Status | Active |
Series | 37432 |
Shape | Square, Pin Fins |
Thermal Resistance @ Forced Air Flow | 6.00°C/W @ 500 LFM |
Thermal Resistance @ Natural | 30.60°C/W |
Type | Board Level |
Width | 1.063" (27.00mm) |