Manufacturer:
Chip Quik Inc.
Description:
THERMALLY STABLE SOLDER PASTE NC
Detailed Description:
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Product Status::
9513 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | No-Clean |
Form | Syringe, 1.23 oz (34.869g) |
Melting Point | 423°F (217°C) |
Mesh Type | 4 |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | - |
Product Status | Active |
Series | CHIPQUIK® |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Storage/Refrigeration Temperature | 37°F ~ 77°F (3°C ~ 25°C) |
Type | Solder Paste |
Weight | - |
Wire Gauge | - |
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