Manufacturer:
CUI Devices
Description:
HEAT SINK, STAMPING, TO-220, 27.
Detailed Description:
Heat Sink TO-220 Copper Alloy 3.0W @ 75°C Board Level, Vertical
Product Status::
6711 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | PC Pin |
Diameter | - |
Fin Height | 0.375" (9.52mm) |
Length | 1.101" (27.96mm) |
Material | Copper Alloy |
Material Finish | Tin |
Mfr | CUI Devices |
Package | Box |
Package Cooled | TO-220 |
Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
Product Status | Active |
Series | HSS |
Shape | Rectangular |
Thermal Resistance @ Forced Air Flow | 10.60°C/W @ 200 LFM |
Thermal Resistance @ Natural | 25.35°C/W |
Type | Board Level, Vertical |
Width | 0.866" (22.00mm) |
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