Manufacturer:
CUI Devices
Description:
HEAT SINK, STAMPING, TO-220, 12.
Detailed Description:
Heat Sink TO-220 Copper Alloy 2.3W @ 75°C Board Level, Vertical
Product Status::
6710 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | - |
Diameter | - |
Fin Height | 0.390" (9.91mm) |
Length | 1.031" (26.20mm) |
Material | Copper Alloy |
Material Finish | Tin |
Mfr | CUI Devices |
Package | Tape & Reel (TR), Cut Tape (CT), Digi-Reel® |
Package Cooled | TO-220 |
Power Dissipation @ Temperature Rise | 2.3W @ 75°C |
Product Status | Active |
Series | HSS |
Shape | Rectangular |
Thermal Resistance @ Forced Air Flow | 14.00°C/W @ 200 LFM |
Thermal Resistance @ Natural | 32.69°C/W |
Type | Board Level, Vertical |
Width | 0.500" (12.70mm) |