Manufacturer:
CUI Devices
Description:
HEAT SINK, STAMPING, TO-220, 19.
Detailed Description:
Heat Sink TO-220 Aluminum Alloy 3.1W @ 75°C Board Level, Vertical
Product Status::
6709 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | - |
Diameter | - |
Fin Height | 0.157" (4.00mm) |
Length | 0.980" (24.89mm) |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Mfr | CUI Devices |
Package | Box |
Package Cooled | TO-220 |
Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
Product Status | Active |
Series | HSS |
Shape | Rectangular |
Thermal Resistance @ Forced Air Flow | 11.60°C/W @ 200 LFM |
Thermal Resistance @ Natural | 23.91°C/W |
Type | Board Level, Vertical |
Width | 0.750" (19.05mm) |
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