Manufacturer:
CUI Devices
Description:
HEAT SINK, BGA, 23 X 23 X 6 MM
Detailed Description:
Heat Sink BGA Aluminum Alloy 3.0W @ 75°C Top Mount
Product Status::
6708 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Adhesive |
Diameter | - |
Fin Height | 0.236" (6.00mm) |
Length | 0.906" (23.00mm) |
Material | Aluminum Alloy |
Material Finish | Black Anodized |
Mfr | CUI Devices |
Package | Box |
Package Cooled | BGA |
Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
Product Status | Active |
Series | HSB |
Shape | Square, Pin Fins |
Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 200 LFM |
Thermal Resistance @ Natural | 25.46°C/W |
Type | Top Mount |
Width | 0.906" (23.00mm) |