Manufacturer:
CUI Devices
Description:
HEAT SINK, BGA, 40 X 40 X 10 MM
Detailed Description:
Heat Sink BGA Aluminum Alloy 6.3W @ 75°C Top Mount
Product Status::
6707 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | CUI Devices |
Series | HSB |
Package | Box |
Product Status | Active |
Type | Top Mount |
Package Cooled | BGA |
Attachment Method | Adhesive |
Shape | Square, Pin Fins |
Length | 1.575" (40.00mm) |
Width | 1.575" (40.00mm) |
Diameter | - |
Fin Height | 0.394" (10.00mm) |
Power Dissipation @ Temperature Rise | 6.3W @ 75°C |
Thermal Resistance @ Forced Air Flow | 3.90°C/W @ 200 LFM |
Thermal Resistance @ Natural | 11.84°C/W |
Material | Aluminum Alloy |
Material Finish | Black Anodized |