Manufacturer:
Chip Quik Inc.
Description:
SOLDER PASTE THERMALLY STABLE NC
Detailed Description:
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Product Status::
2512 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Mfr | Chip Quik Inc. |
Series | CHIPQUIK® |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423°F (217°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 3 |
Process | Lead Free |
Form | Jar, 17.64 oz (500g) |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Base Product Number | TS991S |
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