Manufacturer:
Chip Quik Inc.
Description:
LF SOLDER WIRE 96.5/3/0.5 TIN/SI
Detailed Description:
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 20 AWG, 21 SWG Spool, 1 lb (454 g)
Product Status::
5957 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | NCSW |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.031" (0.79mm) |
Flux Type | No-Clean |
Form | Spool, 1 lb (454 g) |
Melting Point | 422 ~ 428°F (217 ~ 220°C) |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | - |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Wire Gauge | 20 AWG, 21 SWG |
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